C11000 Copper CNC Machining Services
PRECI5 delivers micron-level C110 CNC machining and precision copper machined parts for mission-critical power distribution, thermal management systems, and high-conductivity electronics directly from our advanced Shenzhen facility.
Precision C11000 copper busbars, heat sinks, and custom electrode assemblies machined to engineering tolerances.
Technical Properties & Temper Characteristics of C11000 Copper
Electrolytic Tough Pitch (ETP) C11000 copper provides industry-leading electrical and thermal transport metrics. Because ductile copper is sensitive to mechanical deformation and galling during C11000 copper machining, temper selection dictates both chip behavior and final rigidity.
| Property | Value (Typical) | Engineering Impact |
|---|---|---|
| Density | 8.89 g/cm³ | Mass calculations for busbar frames and heavy thermal masses |
| Electrical Conductivity | 101% IACS | Minimal resistive voltage drop in high-current distribution |
| Thermal Conductivity | 391 W/m·K | Accelerated dissipation across cold plates and liquid cooling lids |
| Tensile Strength | 220–380 MPa | Temper Dependent (O60 soft through H04 hard) |
| Yield Strength | 60–340 MPa | Governs structural deflection under clamping and terminal torquing |
| Hardness (HV) | 60–120 HV | Informs high-shear cutter selection to avoid burr generation |
Chip Control in Soft ETP Copper
Due to high elongation and adhesive behavior, unoptimized tooling yields built-up edges (BUE). We deploy high-rake, polished DLC/diamond-coated end mills combined with high-pressure flood coolant to eject continuous ribbons cleanly.
Thermal Stability Verification
Rapid heat conduction can skew localized part geometries during aggressive pocketing. Our adaptive feed paths maintain even temperature distribution across expansive copper machined parts.
Manufacturing Infrastructure
Core Production Equipment & Metrology
Dedicated capacity configured specifically for non-ferrous and pure copper machining runs from Shenzhen.
Spindles up to 24,000 rpm paired with a generous 900 × 900 × 700 mm working envelope to execute multi-face complex contours, cooling micro-channels, and planar busbar surfaces in unified setups.
- • High-speed dynamic surfacing
- • Reduced setup indexing errors
Live-tooled turn-mill centers delivering synchronized high-throughput production of high-concentricity electrical pins, terminal studs, copper bushings, and thread-critical probe assemblies.
- • Dual-spindle continuous machining
- • Precision thread milling on soft copper
ZEISS coordinate measuring machine (700 × 700 × 600 mm) backed by multi-surface roughness profilometers and benchtop XRF spectrometers for certified compositional validation.
- • GD&T true position auditing
- • Sub-micron contact surface scanning
Applications for C11000 Machined Parts
Where ultra-high conductivity and thermal throughput are decisive engineering constraints, our C110 CNC machining output supports high-voltage electrification, automation, and laboratory hardware.
Busbars & Power Connectors
Multi-axis milled busbars, laminated power distribution shunts, and battery cell interconnects operating with low contact resistance.
Thermal Management Systems
Micro-channel liquid cold plates, heat spreaders, and IGBT chiller baseplates requiring planar flatness under 0.02 mm.
Robotics & Motion Hardware
High-wear electrical slip ring contacts, servo-actuator grounding parts, and custom mechanical couplings combining electrical pathing.
Custom EDM Electrodes
High-purity sinker EDM spark erosion electrodes and spot welding tips requiring uniform metallurgical structure and edge integrity.
Quality Governance
Certified Quality Assurance for Pure Copper Components
PRECI5 executes under robust ISO 9001, IATF 16949, AS9100D, and ISO 13485 operational frameworks. ETP copper demands meticulous staging to avoid indentation, distortion, and atmospheric oxidation throughout CNC milling and lathe passes.
ZEISS 3D Coordinate Metrology (700 × 700 × 600 mm)
Non-contact and low-force touch probes verify true position, hole centers, and complex profile tolerances without scratching malleable copper surfaces.
Contact Plane Surface Profilometry
Calibrated Ra/Rz testing guarantees low interfacial thermal impedance and superior conductivity for busbar bolt interfaces.
XRF Spectrometry Material Validation
Incoming raw lot screening verifies electrolytic grade compliance and rules out oxygen entrapment or low-grade scrap dilution.
Standard Quality Deliverables
Complete dimensional documentation mapped against 2D drawing callouts.
Mill certifications providing lot traceability and chemistry breakdown.
Hardness testing confirming specified O60, H02, or H04 temper levels.
Anti-oxidation vacuum wrapping and compartmentalized cellular crates.
First Article Inspection (FAI) reports compliant with AS9102 available on demand for aerospace and critical power projects.
Engineering FAQ: C11000 Copper Machining
Frequently addressed technical aspects regarding tolerances, surface oxidation, and temper options.
Direct RFQ Submission
Start Your Copper Machining Project
Submit your CAD files (.STEP, .IGES) along with 2D drawings (.PDF) indicating required temper, critical tolerances, and surface treatments. Our Shenzhen engineering hub conducts prompt DFM evaluations and responds with pricing within 24 business hours.
- ✓ Material: Electrolytic C11000 ETP Copper
- ✓ Specify Temper: O60, 1/4 Hard, 1/2 Hard (H02), Hard (H04)
- ✓ Plating: Bare, Tin, Silver, or Nickel Plated
- ✓ Quantities: Rapid Prototyping to Full Production Runs
Send Your Copper Part Drawing & Material Temper
Our application engineers will assess machine setups, tooling clearance, and thermal specs.